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  • Thermal management of high-power LEDs - Wikipedia

    Flip chip – The concept is similar to flip-chip in package configuration widely used in the silicon integrated circuit industry. Briefly speaking, the LED die is assembled face down on the sub-mount, which is usually silicon or ceramic, acting as the heat spreader and supporting substrate.

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  • Flip chip and heat spreader attachment development (Book .

    Get this from a library! Flip chip and heat spreader attachment development. [Yuquan Li; Robert Wayne Johnson] -- Part one of this dissertation was to study the impact of a small amount of Ni on lead free flip chip solder joint thermal shock reliability. Two groups of substrates were used in this study: solder .

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  • Reliability of flip chip packages with high thermal .

    Copper heat spreaders are often used in flip chip in package construction. While providing high thermal conductivity, Cu has a significantly higher coefficient of thermal expansion than Si. In this work, two heat spreader attachment materials, indium for high power and polymeric adhesive for medium power applications, have been investigated.

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  • MICRO AND MESO SCALE COMPACT HEAT EXCHANGERS IN .

    MICRO AND MESO SCALE COMPACT HEAT EXCHANGERS IN ELECTRONICS THERMAL MANAGEMENT-A REVIEW . side of a processor chip or heat spreader, using a thermal . Heat spreader Heat sink Fig. 1 A flip chip package with an integrated air cooled heat sink . 163 Continued growth in heat sink sizes and air speeds to handle higher chip powers are limited by .

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  • FLIP CHIP AND LID ATTACHMENT ASSEMBLY PROCESS .

    FLIP CHIP AND LID ATTACHMENT ASSEMBLY PROCESS DEVELOPMENT Except where reference is made to the work of others, the work described in this dissertation is my own or was done in collaboration with my advisory committee.

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  • US6617683B2 - Thermal performance in flip chip/integral .

    A microprocessor package and a method of dissipating heat therefrom have improved thermal performance by utilizing low modulus thermal interface material between the flip chip, central processing unit and a heat spreader in the package. A modulus of elasticity of the thermal interface material in the kPa range is preferably provided by a cured, filled polymer gel which is lightly crosslinked.

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  • ASE Technology Holding Co., Ltd (ASX) Company Profile & Facts

    See the company profile for ASE Technology Holding Co., Ltd (ASX) including business summary, industry/sector information, number of employees, business summary, corporate governance, key .

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  • US5909056A - High performance heat spreader for flip chip .

    According to one aspect of the invention, a semiconductor package is provided including a package substrate having an upper surface and a lower surface, wherein electrical contacts on the lower surface of the substrate are coupled to corresponding electrical contacts on a printed circuit board by a plurality of solder balls; a semiconductor die having a non-active surface and an active surface .

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  • Mechanical and Thermal Design Guidelines for Lidless Flip .

    The Xilinx lidless flip-chip ball grid array (BGA) packages use the same package substrate design as traditional lidded flip-chip packages, including the same electrical board and thermal conductivity as traditional flip-chip packaging. However, removing the lid (heat spreader) and adding thermal interface material allows direct contact between .

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  • Thermal performance impacts of heat spreading lids on flip .

    Previous studies analyzing thermal performance benefits of lids and heat spreaders in flip chip packaging are numerous, including,, . Most of the studies analyze thermal enhancement of an air-cooled lidded vs. lidless package without additional cooling devices.

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  • Effect of thermal interface materials on manufacturing and .

    Abstract: Power and power density increase in microelectronics is a major challenge for packaging high performance ASIC and microprocessor devices. The thermal interface material (TIM) used between the chip and the heat spreader of the Flip Chip Plastic Ball Grid Array (FC-PBGA) package plays a very important role in the package thermal performance.

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  • Stiffener ring and heat spreader for use with flip chip .

    Sep 07, 1999 · Another object of the present invention is to reduce irreparable metal movement of a stiffener ring and heat spreader of the flip chip packaging assembly during the punching operation for fabrication thereof. Still another object of the present invention is to improve localized flatness of the edges of the stiffener ring and heat spreader.

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  • Heat Spreader | SHINKO ELECTRIC INDUSTRIES CO.,LTD.

    IC's release heat as a result of power consumption. This heating up of the chip can adversely affect the speed and lifetime of the device. The heat spreader ensures safe operation of the electronic circuit by efficiently diffusing the heat released and preventing over heating of the chip.

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  • ICCOMPO - Heat Sink, Metallized Substrate, Assembly Services

    Heat Sink, Submount (CuW, CuMo alloys). Thin-Film, DBC, DPC Metalized Substrate. Packages. Assembly Services for Wire & Ribbon Bond, Die Attach, SMT, Flip Chip

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  • STATS ChipPAC - Flip Chip Chip Scale Package (fcFBGA / fcCSP)

    STATS ChipPAC's fcFBGA packages form a sub-group in the Flip Chip package family which represents the form factor popularly known in the industry as CSP (Chip Scale Package). The fcLFBGA, fcTFBGA-SD2 and fcLGA are produced on substrates with matrix strip format and use overmolding and saw singulation processes similar to wire bond packages of the same form factors.

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  • FC-PBGA, Flip Chip Plastic Ball Grid Array (FC-PBGA)

    advantages of a flip chip Ball Grid Array (BGA) package. Flip chip packages are offered in bare die, flat lid and full lid configurations. Capacitor Silicon Die Underfill Flip Chip Solder Bump Package Substrate BGA Solder Ball Flip Chip Solder Bump Package Substrate BGA Solder Ball Lid / Heat Spreader Thermal Interface Material Silicon Die .

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  • Implementing Xilinx Flip-Chip BGA Packages Application .

    package substrate. These vent holes are kept by design between the heat spreader (lid) and the package substrate to allow for outgassing and moisture evaporation. Recommended PCB Reliability Guidelines Xilinx flip-chip packages are not hermetically sealed and exposure/incomplete removal of

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  • Lidded Versus Bare Die Flip Chip . - Electronics Cooling

    Jun 21, 2012 · Lower cost package options are available today, which are finding applications in high power design spaces that previously only employed copper lid heat spreaders. Exposed die flip chip packages are used frequently in lower power applications .

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  • MICRO AND MESO SCALE COMPACT HEAT EXCHANGERS IN .

    MICRO AND MESO SCALE COMPACT HEAT EXCHANGERS IN ELECTRONICS THERMAL MANAGEMENT-A REVIEW . side of a processor chip or heat spreader, using a thermal . Heat spreader Heat sink Fig. 1 A flip chip package with an integrated air cooled heat sink . 163 Continued growth in heat sink sizes and air speeds to handle higher chip powers are limited by .

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  • Thermal Management and Mechanical Handling for Lidless .

    Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array November 2017 Altera Corporation 1 To prevent the die from chipping or cracking, ensure that the TIM is enough to cover the edges of the die when applying TIM to the heat sink and package. Attaching Heat-Sinks You can attach a heat sink to a heat source in several .

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  • I-CHIUN >> Products >> Heat Spreader >> Flip Chip-Lid/Ring

    Heat Spreader ‧Flip Chip-Lid/Ring ‧ Flip Chip-Hat . ‧Flip Chip-Lid/Ring : 1.In-house die design, manufacture, assembly and trial run. 2.Use 40T to 400T High-speed Precision Stamping / Forging Machine to satisfy various needs of dimension for clients.

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  • ICCOMPO - Heat Sink, Metallized Substrate, Assembly Services

    Heat Sink, Submount (CuW, CuMo alloys). Thin-Film, DBC, DPC Metalized Substrate. Packages. Assembly Services for Wire & Ribbon Bond, Die Attach, SMT, Flip Chip

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  • fcCSP Flip Chip CSP - Amkor Technology

    Amkor's Flip Chip CSP (fcCSP), a flip chip solution in a CSP format. The advantages of flip chip interconnect are multiple: it provides enhanced electrical performance over standard wirebond technology, allows for a smaller form factor due to increased routing .

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  • The Many Flavors of Ball Grid Array Packages | Electronics .

    The top die can be connected electrically to the bottom die using either wire bonding or flip-chip technology. It is possible for the top die to be connected electrically to the substrate using bond wires. Heat Spreaders. The use of a heat spreader can play a significant role in enhancing the thermal performance of a package.

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  • Flip-chip package with a heat spreader for high power .

    Flip-chip package with a heat spreader for high power dissipation LSI chips Abstract: Today's LSIs consume more power than their predecessors, so packages are required to cool them effectively. To make a package with a thermal resistance of less than 1 K/W, we developed a flip-chip C-BGA (ceramic-ball grid array) package with a large heat .

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  • Understanding Voids in Flip Chip Interconnects

    Flip Chip Interconnects. Eric Perfecto – 2016 CPMT Webinar 2 . Heat spreaders passive, active Thermal Interface Materials paste, gels, metals BGA Printed Wiring Board (PWB) Heat sinks Cu, Al, complex design Chip-Package Interaction CTE stresses, low K BEOL 3 1st and 2nd Level Packaging Technology Elements

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  • AMD Athlon Heatspreader! | AnandTech Forums: Technology .

    Aug 18, 2002 · I've never chipped/cracked a flip-chip core, either P3/Celeron or AMD (knock on wood). For heat transfer purposes, it would add two layers to the path the heat must travel and would increase thermal resistance as a result, since one of the two layers (namely, the thermal compound) has higher thermal resistance than the materials joined.

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  • Flip Chip and Heat Spreader Attachment Development

    Part two of this dissertation was to study metallization and indium solder based heat spreader attach for flip chip in package applications. For metallization stack selection, it is commonly believed that during soldering and the following solder joint service life time, the solder materials should not consume the underling metallization .

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  • 3D FRACTURE MECHANICS ANALYSIS OF UNDERFILL .

    paper, a full parametric 3D model of flip chip package with heat spreader is developed with the capability of explicit modeling of 3D cracks. The crack driving force is computed as the functions of underfill properties including coefficient of thermal expansion and Young's modulus, as well as underfill fillet dimensions.

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  • STATS ChipPAC - Flip Chip Chip Scale Package (fcFBGA / fcCSP)

    STATS ChipPAC's fcFBGA packages form a sub-group in the Flip Chip package family which represents the form factor popularly known in the industry as CSP (Chip Scale Package). The fcLFBGA, fcTFBGA-SD2 and fcLGA are produced on substrates with matrix strip format and use overmolding and saw singulation processes similar to wire bond packages of the same form factors.

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  • How to identify chip packages/old | How To Wiki | FANDOM .

    This page contains all computer chip or integrated circuit packages. A chip package is what surrounds the integrated circuit die and connects the die's pads to the packages external pins. Howto identify integrated circuit(IC) chip packages/All images DIP: Dual inline package 0.6" [1] Skinny DIP.

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  • Thermal performance impacts of heat spreading lids on flip .

    Previous studies analyzing thermal performance benefits of lids and heat spreaders in flip chip packaging are numerous, including,, . Most of the studies analyze thermal enhancement of an air-cooled lidded vs. lidless package without additional cooling devices.

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  • Flip Chip Packages - SPIL

    Flip Chip Packages: . to internal points on a die, resulting in better chip performance. To increase thermal performance, optional heat spreaders can be attached on the backside of the flipped die. . Optional heat spreader attaching process can provide a superior heat dissipation of flip chip dies, which are suitable for high-end .

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  • US6617683B2 - Thermal performance in flip chip/integral .

    A microprocessor package and a method of dissipating heat therefrom have improved thermal performance by utilizing low modulus thermal interface material between the flip chip, central processing unit and a heat spreader in the package. A modulus of elasticity of the thermal interface material in the kPa range is preferably provided by a cured, filled polymer gel which is lightly crosslinked.

    Get Price Online
  • STATS ChipPAC - Flip Chip Ball Grid Array (fcBGA)

    STATS ChipPAC's high-end BGA Flip Chip packages include the fcBGA, fcBGA-SiP, fcBGA-H and fcBGA-MPM. The fcBGA package is the main platform in this package sub-group, which also includes a thermally enhanced version with heat spreader (fcBGA-H) and a package subsystem meeting the standard BGA footprint that contains multiple components within the same package (fcBGA-MPM).

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  • 44 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING .

    Flip chip in package is commonly used to address the high I/O counts. This packaging method exposes the backside of the semiconductor die for heat removal. A high thermal conduc-tivity heat spreader significantly larger than the Si die is typi-cally attached to the back of the die to serve as a large area in-

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  • Effect of thermal interface materials on manufacturing and .

    Abstract: Power and power density increase in microelectronics is a major challenge for packaging high performance ASIC and microprocessor devices. The thermal interface material (TIM) used between the chip and the heat spreader of the Flip Chip Plastic Ball Grid Array (FC-PBGA) package plays a very important role in the package thermal performance.

    Get Price Online
  • Flip Chip | TF AMD

    Flip Chip Packages that the factory assemble and test are for Micro Processor, Graphic Processor, Communication & Set Top Box application. Flip Chip package types cover Single Die Package, Multi Chip Module (MCM), Coreless Substrate Package, Bare Die Package (Lidless Package), Lidded or Heat Spreader Package and Stiffener Package. Capability

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  • Package-Type Guide for Intel® Desktop Processors

    OLGA stands for Organic Land Grid Array. The OLGA chips also use a flip chip design, where the processor is attached to the substrate facedown for better signal integrity, more efficient heat removal and lower inductance. The OOI then has an Integrated Heat Spreader (IHS) that helps heatsink dissipation to a properly attached fan heatsink.

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  • What is FC-PGA (flip chip-pin grid array)? - Definition .

    FC-PGA (flip chip-pin grid array) is a microchip design developed by Intel for its faster microprocessor s in which the hottest part of the chip is located on the side that is away from the motherboard .

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